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Technical advantages
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Gather glimmers to light up the future
Technical advantages
Advanced technology
1、Enhanced FSI Pixel 2、Large Scale Stitching Process
High Light Transmittance DT (95%) vs NDC Removal (92%) Decreased Mask Consumption (41 -> 33 layers)
Stitched Full Frame 36*24mm 24M Pixels CIS on 12-inch wafer
Large Scale Stitching applied to FEOL: NW, SDN, SDP, AA, Poly BEOL: All Metal, Via 55nm Stitching Technology with absolute precision of 5nm (<10%)
3、
BSI (背照技术) Pixel
QE &SNR improvement
Low cross talk
Excellent SNR
4、3D Stacked BSI (under development)
Large Scale Stitching applied to
FEOL: NW, SDN, SDP, AA, Poly
BEOL: All Metal, Via
Company Office Number:
028-68669333
Company Email:
imgds@imagedesign.com.cn
Company address:
9-10F, Unit 2, Building B6, No. 171, Hele Second Street, High tech Zone, Chengdu
301, Floor 3, Sanda Science and Technology Building, No. 1, Keji Road, Nanshan District, Shenzhen