先进的工艺技术
1、Enhanced FSI Pixel 2、Large Scale Stitching Process
High Light Transmittance
DT (95%) vs NDC Removal (92%)
Decreased Mask Consumption (41 -> 33 layers)
Stitched Full Frame 36*24mm 24M Pixels CIS on 12-inch wafer
Large Scale Stitching applied to
FEOL: NW, SDN, SDP, AA, Poly
BEOL: All Metal, Via
55nm Stitching Technology with absolute precision of 5nm (<10%)
3、BSI （背照技术） Pixel
QE &SNR improvement
Low cross talk
Excellent SNR
4、3D Stacked BSI (under development)
Large Scale Stitching applied to
FEOL: NW, SDN, SDP, AA, Poly
BEOL: All Metal, Via
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